Tabletop Manual Wire Bonder "IBOND5000"
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
The "IBOND5000" is an advanced tabletop manual wire bonding (die bonding) device used in process development, production, and research. It features an adjustable work holder height to enhance flexibility. It offers high yield and excellent reproducibility for all bonding applications, including optoelectronic modules, hybrid/MCM, microwave products, and chip-on-board. 【Product Lineup】 - Dual wire bonding device (easily switchable between wedge/ball settings) - Ball wire bonding device - Wedge wire bonding device 【Features】 - Adjustable work holder height for improved flexibility - Compatible with copper wire bonding - Ergonomically designed for ease of use - 24/7 online technical support
- Company：Micro Point Pro ltd 本社
- Price：Other
